The design of integrated circuits for InGaAs/InP or silicon SPADs represents a fundamental step for upcoming new applications in the automotive field, non-line-of-sight or in medicine research (for instance related to brain imaging or characterization of tumour cells). The aim of this thesis work is the design of an 8-pixel integrated linear array of electronics for InGaAs/InP and silicon SPADs working in fast gating mode (implemented with a fast pulser that enables the SPAD with subnanosecond ON/OFF transitions). Each one of the pixels will be composed by an Active Quenching Circuit (AQC) with high performance characteristics and reliability (quenching time smaller than 1 ns). The circuit will be fabricated in 0.35μm AMS SiGe BiCMOS technology.
La progettazione integrata di SPAD InGaAs/InP e silicio risulta essere un passo fondamentale per molte applicazioni di carattere pratico in diversi settori, ad esempio automotive, non-line-of-sight imaging o nella medicina (brain imaging o diagnosi di tumori). Lo scopo di questo lavoro di tesi consiste nel progetto di un array lineare integrato di 8 pixels per SPAD InGaAs/InP o silicio in modalità fast gating (transizioni di gate sotto il nanosecondo). Ogni pixel è composto da un veloce circuito di Active Quenching (AQC) (spegnimento della valanga in meno di 1 ns), realizzato in tecnologia di 0.35 μm AMS SiGe BiCMOS.
Multi-channel integrated circuit for sub-nanosecond gating of SPAD array
MUÑOZ MARTÍN, IRENE
2016/2017
Abstract
The design of integrated circuits for InGaAs/InP or silicon SPADs represents a fundamental step for upcoming new applications in the automotive field, non-line-of-sight or in medicine research (for instance related to brain imaging or characterization of tumour cells). The aim of this thesis work is the design of an 8-pixel integrated linear array of electronics for InGaAs/InP and silicon SPADs working in fast gating mode (implemented with a fast pulser that enables the SPAD with subnanosecond ON/OFF transitions). Each one of the pixels will be composed by an Active Quenching Circuit (AQC) with high performance characteristics and reliability (quenching time smaller than 1 ns). The circuit will be fabricated in 0.35μm AMS SiGe BiCMOS technology.File | Dimensione | Formato | |
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2017_07_Munoz.pdf
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Descrizione: Testo della tesi
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https://hdl.handle.net/10589/135515