Chip Embedding Technology is taking the electronics industry by storm, due to the various benefits associated to it. In such technology pick and place operations are very important and suitable grippers are necessary. In this thesis work, an attempt is made to design an innovative vacuum gripper, which can pick and place the micro-electronic components with size down to 0201 (0.2 x 0.1mm). The main feature of this vacuum gripper is that it can pick and place a wide range of components with its unique design, and all range of micro-electronic components handled by this gripper can be placed inside a cavity to ensure the use of Chip Embedding Technology at the production scale. Therefore, designing such kind of gripper could lead to various benefits in the Chip Embedding Technology, which is unique in its own kind being smart, flexible, cost efficient. Moreover, the thesis also focuses on the reworking machine ONYX29 from Infotech by building the program sequence for soldering and pick and place operation by the gripper along with using the flexibility of the machine for this operation. Furthermore, while designing the gripper and using the machine, ISO clean room standards and material selection is taken into consideration.
La tecnologia Chip Embedding sta prendendo d'assalto l'industria elettronica, a causa dei vari vantaggi ad essa associati. In tale tecnologia le operazioni di pick and place sono molto importanti e sono necessarie pinze adeguate. In questo lavoro di tesi si cerca di progettare una innovativa pinza a depressione, in grado di prelevare e posizionare i componenti microelettronici con dimensioni fino a 0201 (0,2 x 0,1 mm). La caratteristica principale di questa pinza a vuoto è che può prelevare e posizionare un'ampia gamma di componenti con il suo design unico, e tutta la gamma di componenti microelettronici gestiti da questa pinza può essere posizionata all'interno di una cavità per garantire l'uso della tecnologia Chip Embedding alla scala di produzione. Pertanto, la progettazione di questo tipo di pinza potrebbe portare a vari vantaggi nella tecnologia Chip Embedding, che è unica nel suo genere essendo intelligente, flessibile ed economica. Inoltre, la tesi si concentra anche sulla macchina di rilavorazione ONYX29 di Infotech costruendo la sequenza del programma per la saldatura e l'operazione di pick and place da parte della pinza insieme all'utilizzo della flessibilità della macchina per questa operazione. Inoltre, durante la progettazione della pinza e l'utilizzo della macchina, vengono presi in considerazione gli standard ISO per camere bianche e la selezione dei materiali.
Design and development of an innovative vacuum gripper for assembly of SMD components
KADAM, SWARAJ
2019/2020
Abstract
Chip Embedding Technology is taking the electronics industry by storm, due to the various benefits associated to it. In such technology pick and place operations are very important and suitable grippers are necessary. In this thesis work, an attempt is made to design an innovative vacuum gripper, which can pick and place the micro-electronic components with size down to 0201 (0.2 x 0.1mm). The main feature of this vacuum gripper is that it can pick and place a wide range of components with its unique design, and all range of micro-electronic components handled by this gripper can be placed inside a cavity to ensure the use of Chip Embedding Technology at the production scale. Therefore, designing such kind of gripper could lead to various benefits in the Chip Embedding Technology, which is unique in its own kind being smart, flexible, cost efficient. Moreover, the thesis also focuses on the reworking machine ONYX29 from Infotech by building the program sequence for soldering and pick and place operation by the gripper along with using the flexibility of the machine for this operation. Furthermore, while designing the gripper and using the machine, ISO clean room standards and material selection is taken into consideration.File | Dimensione | Formato | |
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https://hdl.handle.net/10589/166373