Thermal analysis of induction cooktop

Induction cooking is not a radically new invention; it has been widely used all around the world. With recent improvements in technology and the consequent reduction of component costs, Induction cooking equipment is now more affordable than ever. Whirlpool Corporation is one of the leading Kitchen, Laundry and Home Appliances Group and introduction of Induction Cooktops to the Consumer Market is one of the revolutionary steps taken by Whirlpool Corporation. According to the U.S. Department of Energy, the efficiency of energy transfer for an induction hob is 84%, versus 38% for Gas stove and 68% for a smooth-top non-induction electrical unit, for an approximate 16% saving in energy for the same amount of heat transfer. This study is an example of their product research and development and thus will discuss their new product, an induction cooktop. It reveals the Thermal analysis and efficiency of an induction cooktop with the detailed calculations and analysis of each component of an induction cooktop through Mathematical Model and Experiments. To calculate the efficiency of the induction cooktop, a standard test Experiment was performed. During Electronic operation, heat was lost in different components of electronic board. A Matlab model was used to calculate different parameters for heat sink. Extensive study was done on calculation of heat loss in copper coil for different dimensions of pancake coils. Comparing the two results of experimental and theoretical model, both calculations give different values for the heat dissipation in each section but the calculation for the overall efficiency of the cooktop is very much similar for both models. A simulation study for the pot containing water at a steady state temperature conditions is suggested so that the evaporation rate and the heat lost to the environment from walls of the pot can be verified. A study for measuring the effect of forced convection over electronic board is also proposed. A relationship between the air velocity and the flowrate over electronic board can help to understand the temperature distribution in interior of the cooktop. This study will show the effect of heat dissipated by heat sink, which fails to go out of the cooktop and the affect of heat dissipated by copper coil to cooktop interior and on the temperature of electronic components.